Signal Processing Group Inc., uses outsourced technology from a number of world class fabrication houses in the U.S, Europe and Asia. This ensures that we will always be able to access the most up to date technologies for our analog and mixed signal ICs, wireless ASICs and modules
as well as pcb based products. The quality levels of all our technology partners are industry and world class.

The following are the technologies being used currently at Signal Processing Group Inc for analog and mixed signal and wireless designs and products:

 

• CMOS technology , from 0.13 um to 1.2 um ( High Voltage)
• 0.18 um and 0.35 um SiGe technology
• GaAs for MMICs
• High Voltage BiCMOS technology ( up to 550V)
• Standard buried collector bipolar technology.
• Bipolar, CMOS, DMOS ( BCD) technology