As the frequencies of operation get higher and higher, we find that the component manufacturers are switching to chip level devices rather than packaged parts. The reasons for this are many and varied, but suffice it to say that it is happening. Thus if you are developing a module level product for high frequencies then you should be prepared for this and find appropriate assembly facilities or vendors who will not only fabricate a board for you but also be able to do COB ( chip on board) assembly. Please visit the Signal Processing Group Inc. website for other interesting articles and information on our services and products.